From October 18th to 21st, McCormick Place is hosting PACK EXPO International 2026, one of the leading appointments for the packaging industry and process technologies. The event brings together over 2,700 exhibitors and presents solutions for more than 40 industrial sectors, confirming the transversal dimension of a sector involving production, logistics, food, beverages and many other industries.
Organized by PMMI, the U.S. association that represents packaging and processing technologies, the fair offers manufacturers, businesses and professionals the opportunity to observe innovations directly in operation, compare technical solutions and develop new business relationships.
In this context, the exhibition dimension plays a role that goes beyond the simple presentation of products and machinery. The spaces through which companies tell each other contribute to defining their identity, to make the skills recognizable and to create opportunities for meeting customers and partners.
It is in this perspective that the Henoto Group, an integrated global platform for solutions in the areas of events, leisure, corporate and entertainment, as well as trade fairs, retail and contract. An ecosystem that integrates design, technology, production and operational skills in a model able to follow each project in its different stages, from conception to realization. Thanks to an international network and an articulated offer, Henoto develops tailor-made solutions for brands, companies and organizers, transforming spaces and needs into experiences that enhance the identity of customers and accompany their presence on international markets.
At PACK EXPO Chicago, Henoto has created the installations for Berhalter, Zambelli, Senzani Brevetti, Clevertech, In Pack Machinery, Bergami, Brevetti CEA, Stevanato, Copamex, Macchi, I2R North America, SACMI, ICA, Mini Motor and Turatti. A group of collaborations that fits into a phase of strong commercial development in the United States, where the group aims to consolidate its presence and to be increasingly close to the needs of the partners.
The design of exhibition spaces is an integral part of the presence of companies at PACK EXPO, where technological innovation becomes a strategic element for the companies present. The layout of the spaces, the choice of materials and the visual identity are an integral part of the presentation of products and business skills, elements that help to define the image of brands and their positioning on the market.
In the United States, the Henoto group is a reality already rooted in the North American market and protagonist of a growth path that progressively expands the range of action of the Group. A presence that expresses the international dimension of the company and its ability to operate directly on the American market, providing brands with a leading experience in trade fairs and temporary architecture.
PACK EXPO International continues until 21 October. In addition to the technologies for packaging and industrial automation, the event offers a perspective on relations and skills that support the competitiveness of industry enterprises on international markets.
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